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Standard Membranes - Multichip Arrays

Multichip SiNx Membrane Arrays

Batch-processable chip arrays for parallel fabrication, uniformity, and streamlined device preparation.

Norcada Multichip Array devices contain multiple SiNx membrane chips held together within a support frame. This arrangement allows for parallel processing of SiNx membranes for high uniformity between samples. Multichips are ideal for applications involving spin coating photoresists, Electron Beam Lithography (EBL) and Focused Ion Beam (FIB) processing, or cell culturing sample prep.

Multichip Arrays have a central support piece designed to fit over a standard spin coater vacuum chuck. The outer sacrificial edge of the Multichip is optimized to isolate spin coating edge bead effects from the SiNx membrane devices for improved process uniformity.

After processing at your lab, multichip arrays can easily be singulated into individual chips. Multichips are available for standard 3.0mm dia. TEM-grid chips, as well as standard 5mmx5mm and 10mmx10mm square frame X-ray chips.

Designed for Parallel Processing:

  • Each multichip device includes:

    • A central vacuum-compatible support for spin coaters

    • A sacrificial perimeter that reduces edge bead effects during coating

    • Easy singulation grooves for post-process chip separation

  • Available for chip formats including:

    • 3.0 mm TEM grids

    • 5 × 5 mm and 10 × 10 mm X-ray frames

    • Custom chip designs (upon request)

Available Features & Options

Customize your multichips for your experimental setup:

FeatureDescriptionNotation
Low-Resistivity Silicon FramesEnhances charge/heat dissipation during SEM, EBL, and FIB-LR
Noise Reduction Underlayer (U/L)Reduces electrical cross-talk; recommended for in situ biasing and ionic translocation-AO or -CO
EBL/FIB Alignment MarksPassivated global/local marks for patterning, focusing, and alignmentMC8E or MC12E
Top Layer ModificationsHydrophobic/hydrophilic coatings, electrode patterning, custom nano-featuresUpon Request

All standard NORCADA chip formats (TEM, X-ray, Square, Round,  NanoPore, and UberFlat™) can be manufactured in multichip format for high-volume or integrated research environments.

SiNx Specification Ranges:

  • Membrane stress: 10 MPa to 1100 MPa

  • Thickness: 10 nm to 6000 nm

  • Membrane area: 5 µm × 5 µm up to 100 mm × 100 mm (or Ø20 µm to Ø100 mm)

  • Frame size: 1 mm × 1 mm up to 150 mm × 150 mm

  • Frame thickness: 100 µm (MX), 200 µm (NX), 380 µm (PX), 500 µm (QX), and thicker on request

  • Formats: Single-window or multi-window arrays

Looking for something more specialized? We also offer SiNx membranes as part of advanced solutions for:

Multichip Arrays of 3mm dia. TEM frame SiNx Membranes, 200µm thick

*Please contact for pricing and availability

Part NumberSiNx ThicknessWindow Size AreaAdditional Features
MC12-NT005A-LR50nm0.05×0.05mmN/A
MC12-NT005Y-LR20nm0.05×0.05mmN/A
MC12-NT005Y-AO/O-LR20nm0.05×0.05mmU/L: 60nm SiOx
MC12E-NT005A-LR50nm0.05×0.05mmEBL Alignment Marks
MC12E-NT005Y-LR20nm0.05×0.05mmEBL Alignment Marks
MC12E-NT005Y-AO/O-LR20nm0.05×0.05mmEBL Alignment Marks U/L: 60nm SiOx

*Please contact for pricing and availability

Part NumberSiNx ThicknessWindow Size AreaAdditional Features
MC8-NX5150A-LR50nm1.50×1.50mmN/A
MC8-NX5150C-LR100nm1.50×1.50mmN/A
MC8E-NX5150A-LR50nm1.50×1.50mmEBL Alignment Marks
MC8E-NX5150C-LR100nm1.50×1.50mmEBL Alignment Marks
MC8-NBPX5004Z-AO/O-HR12nm0.04×0.04mmU/L: 60nm SiOX
MC8E-NBPX5004Z-AO/O-HR12nm0.04×0.04mmEBL Alignment Marks U/L: 60nm SiOX

Need Custom Fabrication for Your Project?

Reach out to us to learn more about how we can customize your solutions or visit our Innovation Platform page for more information.